PCBA Production Capabilities

• ENIG (standard)
• ENIPIG
• Lead-free HASL
• EHG

• 10mil min (0.15mm) - Standard mfg
• 3mil min (0.07mm) - Extended mfg

• 2
• 4
• 6
• 8
• 10
• 12
• 14
• 16
• 18
• 20
• 22
• 24
• 32

• Hard gold–supported
• Edge fingers–supported
• Beveled edges
• Flying probe
• Castellations

• FR4-TG1785 (standard)
• Rogers 4003C
• Rogers 4350B
• Rogers 4450B
• Rigid-Flex
• Aluminum
• Other: requires custom quote

• Supported

• Max dimensions: 14.9” x 14.9” (378.46mm x 378.46mm)
• Minimum billable area: 1 square inch (25.4mm²)
• Custom quote required for larger boards

• 0.062” (1.6mm) standard
• 0.008”-0.248” (0.2mm-6.3mm) custom
• PCB thickness increments at 0.0004” (0.1016mm)
• Board thickness tolerance:
• T < 1.0mm: ±15%
• 1.0 > T<1.6mm: ±10%
• T>1.6mm: ±10%

• Unless otherwise requested, all assemblies are built to meet IPC-A-610H Class 2 Acceptance criteria
• Visual inspection on all boards
• X-Ray used for manufacturing validation
• AOI only over a certain quantity (25 or more)

Internal rout radius- 0.8mm External rout radius- 1.0mm Laser drill- 4mil-8mil

• 10mil min (Standard Drill)
• 4mil min (Extended Drill)

• 10mil min (Standard Drill)
• 4mil min (Extended Drill)

• Blind and buried vias
• Back drilled vias
• Micro drill vias
• Epoxy filled and capped vias

• Non-conductive Epoxy
• Conductive epoxy
• Copper

• 10 max (standard drill)
• 16 max (extended drill)

• Supported as per our minimal drill size in DRC

• Internal rout radius- 0.8mm
• External rout radius- 1.0mm
• Laser drill- 4mil-8mil

• 10mil min (Standard Drill)
• 4mil min (Extended Drill)

• 10mil min (Standard Drill)
• 4mil min (Extended Drill)

• Blind and buried vias
• Back drilled vias
• Micro drill vias
• Epoxy filled and capped vias

• Non-conductive Epoxy
• Conductive epoxy
• Copper

• 10 max (standard drill)
• 16 max (extended drill)

• Supported as per our minimal drill size in DRC

• RoHS/lead-free solder only
• SAC305 for surface mount
• SN100 only for through-hole
• Solder resist: top and bottom standard

• Red
• Green
• Blue
• Yellow
• Black
• White
• Matte Black
• Dark Brown
• Transparent
• Light Green
• Matte Green

• .1mm

• Min 4mil

• Red
• Green
• Blue
• Yellow
• Black
• White

• 5mil

• SMT: no-clean
• Through-hole: no-clean or water wash

• Supported

• AS9100D
• UL Registered
• ISO13485
• ISO/IATF 16949
• ISO9001
• ISO14001

• Single-sided or double-sided
• Through-hole
• SMD
• BGA
• LGA
• PTH
• Hybrid
• SoP
• Daughterboard components
• Modules
• We support double-sided assembly

• Linear blade
• Mouse bites
• Routed

• Supported

• Chip components, ex: resistors/ capacitors 01005 10 mil x 05 mil (0.25mm x 0.0125mm)
• Leaded packages, ex: SOIC/QFP/TSOP 11.8 mil (0.3mm) Lead Pitch
• Leadless packages, ex: QFN, TQFN 11.8 mil (0.3mm) Lead Pitch
• BGA, ex: BGA/FBGA/LGA 15.7 mil (0.4mm) Ball Pitch

A UV tracer is added to all conformal coating and boards are inspected under a UV light according to certified industry standards.