PCBA Production Capabilities

Built In North America

Download the PDF Version

PCB Specifications

Layer Count and Stackups

  • 2-36 Layers
  • Default and Custom Stackups Available

Surface Finish

  • ENIG (standard)
  • ENIPIG
  • Lead-Free HASL
  • EHG

Materials

  • FR4-TG175 (standard)
  • Rogers 4003C
  • Rogers 4350B
  • Rogers 4450B
  • Aluminum
  • Other materials possible - contact for details

Copper Weight

  • ½ oz (18µm)
  • 1 oz (35µm)
  • 2 oz(70µm)
  • Other weights possible - contact for details

Soldermask & Silkscreen Colors

  • All Standard Colors
  • Custom colors available on request

Fabrication Processes

  • Plated Slots
  • Impedance Control
  • Hard Gold
  • Edge Fingers
  • Beveled Edges
  • Blind, Buried, Micro-Drilled, Back-Drilled Vias
  • Via in Pad - Epoxy Filled and Capped Vias
  • Castellations

Via Fill Options

  • Soldermask Tented
  • Non-Conductive Epoxy
  • Conductive Epoxy
  • Copper

Board Area

  • Max dimensions: 14.9” x 14.9” (378.46mm x 378.46mm)
  • Minimum billable area: 1 square inch (25.4mm²)
  • Larger boards possible - contact for details

Board Thickness

  • 0.062” (1.6mm) standard
  • 0.008”-0.248” (0.2mm-6.3mm) custom

PCB Assembly

Solder Types

  • RoHS/Lead-Free Solder Only
  • SAC305 for Surface Mount
  • SN100 Only for Through-Hole

Flux Types

  • SMT: no-clean
  • Through-Hole: no-clean or water wash

Assembly Supported

  • Single-Sided or Double-Sided
  • Through-Hole (PTH)
  • SMD
  • BGA
  • LGA
  • SoP
  • Modules and Daughterboard

Mechanical Component Limits

  • Chip Components, ex: resistors/ capacitors
    • 01005 10 mil x 05 mil (0.25mm x 0.0125mm)
  • Leaded Packages, ex: SOIC/QFP/TSOP
    • 11.8 mil (0.3mm) Lead Pitch
  • Leadless Packages, ex: QFN, TQFN
    • 11.8 mil (0.3mm) Lead Pitch
  • BGA, ex: BGA/FBGA/LGA
    • 15.7 mil (0.4mm) Ball Pitch

Depanelization

  • V-Score and Linear Blade
  • Mouse Bites
  • Fully Routed

Machines and Processes

  • Solder Paste Screen Printers
  • Solder Paste Jet Printers
  • SMT Pick and Place machines
  • Convection Reflow Ovens
  • Automatic Optical Inspection
  • PCB Automatic Board Washers
  • Selective and Wave Through Hole Soldering
  • X-Ray inspection

Box Build and Testing

Conformal Coating

  • Spray and Dipping Processes
  • UV Tracer and Coverage Checks
  • Materials: Acrylic, Silicone, Polyurethane

Component Programming

  • Pre-Assembly Flashing
  • In-Circuit Programming
  • All major microcontroller programming supported

Full Product Assembly

  • Labels and Serialization
  • Epoxy Encasement
  • Enclosure Assembly
  • Packaging and Documentation

Testing and Validation

  • Full Functional
  • In-Circuit Testing (ICT)
  • Burn-In Cycles
  • Flying Probe
  • RF Spectrum Testing

Design Rules (DRC)

Design Minimums

  • Trace Width - 3 mil (0.0762mm)
  • Spacing - 3 mil (0.0762mm)
  • Annular Ring - 3 mil (0.0762mm)
  • Clearance: Copper to Edge of Board - 3 mil (0.0762mm)
  • Drill Size - 4 mil (0.1016mm)
  • NPTH Drill to Drill - 6 mil (0.1524mm)
  • PTH Drill to Drill - 19.69 mil (0.5mm)
  • Paste Aperture - 6 mil (0.1524mm)
  • Paste Clearance - 6 mil (0.1524mm)
  • Silkscreen Size - 5 mil (0.127mm)
  • Silkscreen Text Height - 32 mil (0.8mm)
  • Soldermask Dam - 3.93 mil (0.1mm)
  • External Route Radius - 39.37 mil (1.0mm)
  • Internal Route Radius - 31.49 mil (0.8mm)

Tolerances

  • Board thickness tolerance:
    • T < 1.0mm: ±15%
    • 1.0 > T<1.6mm: ±10%
    • T>1.6mm: ±10%
  • PCB Board Edge
    • ± 6 mil (0.15mm)
  • NPTH Drill Hole Size
    • ± 2 mil (0.05mm)
  • PTH Drill Hole Size
    • ± 3.15 mil (0.08mm)

Quality and Certifications

MacroFab Manufacturing Guarantee

  • Workmanship for one year after manufacturing
  • Information and Intellectual Property is 100% confidential
  • Transparent communication and order visibility
  • Whatever it takes to get it right - for free

Inspection

  • Visual Inspection on All Assemblies
  • First Article Inspection Images for Customer/ Engineering Review
  • X-Ray for Underpackage Leads (BGA And QFN) and Engineering Validation
  • Automated Op

IPC-A-610H

  • All assemblies are built to meet IPC-A-610H Class 2 with Class 3 available

MacroFab Facility Certifications

  • ISO9001:2015
  • IPC class 2 and 3 Production
  • ITAR Registered

Partner Facility Certifications

  • AS9100D
  • UL Registered
  • IPC class 2 and 3 Production
  • ISO13485
  • ISO/IATF 16949
  • ISO9001
  • ISO14001

IPC-A-610

  • ESD Safety Procedures
  • PCB Assemblies Meet Class 2 with Class 3 Available

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