Tombstoning
Tombstoning is a soldering defect in surface mount technology (SMT) where one end of a component, typically a chip resistor or capacitor, lifts off the PCB, resembling a tombstone. Tombstoning occurs due to uneven wetting forces during the reflow soldering process. If one end of the component is heated and wetted with solder before the other, the surface tension can pull the component upright.
This defect leads to poor electrical connections and can render the PCB non-functional. Several factors contribute to tombstoning, including:
- Uneven heating: Variations in temperature across the PCB.
- Component placement: Misalignment or improper orientation.
- Solder paste application: Inconsistent or insufficient solder paste deposition.
To prevent tombstoning, manufacturers ensure even heating in the reflow oven, accurate component placement, and consistent solder paste application.
Read more about how to avoid tombstoning issues now.
Categories: PCBA Manufacturing