electronics podcast, Erik Welsh, Gene Frantz, MacroFab, macrofab engineering podcast, MEP, Octavo Systems, OSD335X C-SIP, System on Chip, System-in-Package
engineering podcast

MEP EP #143: System-In-Package Platforms

Download: MP3
RSS Feed: Link
Twitter: @MacroFab

Runtime: (00:47:37)

Parker Dillmann
Stephen Kriag

Octavo Systems

Podcast Notes

  • Gene Frantz – Chief Technology Officer for Octavo Systems
    • One of the founders and the visionary behind Octavo Systems
    • Professor in the Practice at Rice University in the Electrical and Computer Engineering Department
    • Was the Principal Technology Fellow at Texas Instruments where he built a career finding new opportunities and building new businesses to leverage TI’s DSP technology
    • Holds 48 patents and has written over 100 papers/articles and presents at conferences around the globe
    • Has a BSEE from the University of Central Florida, a MSEE from Southern Methodist University, and a MBA from Texas Tech University
  • Erik Welsh – Applications and Systems Manager for Octavo Systems
    • Has over 16 years of industry experience designing hardware and software systems, including 11 years at Texas Instruments
    • Supported hundreds of developers bringing embedded systems quickly to market
    • Simplifying complex systems is a passion and mentors engineers developing embedded Linux systems
    • Developed platforms for cutting-edge wireless research to provide open-access to startups
    • Began his career as a SoC (System-On-Chip) designer eventually leading SoC Security Architecture development
    • Currently holds multiple patents in the area of System-in-Package technology
    • Has a Bachelor of Science and Masters in Electrical Engineering from Rice University
  • Octavo Systems
    • For more background on Octavo Systems check out MEP EP#17: System-in-Package (SiP) Platforms with Greg Sheridan.
    • Octavo’s goal is to make designing electronics easier and more accessible with System-in-Package devices that abstract away the tedious complexities that go along with designing an electronic system.
    • Ease of use is in everything Octavo does from choosing silicon partners to the way boards are designed.  Octavo offers an entire experience to help designers get from an idea to an actual product.
    • They offer Application Notes, a complete tutorial series which walks through setting up Eagle all the way through booting Linux on a custom board, and direct access to system experts through support and forums.
    • Several reference designs are available with more coming.
    • The new OSD335x C-SiP is a great example. As a Complete System in Package, designers can add a few resistors and power giving a complete Computer in a 27mm package.
    • Utilizing System-in-Package not only reduces board BOM but also manufacturing cost at the board level.
    • How do System-In-Package devices make designers and engineers lives easier?
    • Certification for FCC and CE? Some modules are pre FCC certified with an ID. Is there a benefit using a System-in-Package to reduce product development risk here?
    • OSD335x C-SIP
    • The Future of SIP

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Gene Frantz – Chief Technology Officer for Octavo Systems

Gene Frantz – Chief Technology Officer for Octavo Systems


Erik Welsh – Applications and Systems Manager for Octavo Systems

Erik Welsh – Applications and Systems Manager for Octavo Systems

Special thanks to whixr over at Tymkrs for the intro and outro!