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MacroFab’s Assembly Capabilities
Mechanical Limits on Part Package Size for Assembly
The parts to be assembled onto a PCB must be equal to or larger then the following specifications.
|Type||Examples||Standard Manufacturing||Extended Manufacturing|
|Chip Components||Resistors/Capacitors||0402 40 mil x 20 mil (1mm x 0.5mm)||0201 20 mil x 10 mil (0.5mm x 0.25mm)|
|Leaded Packages||SOIC/QFN/TSOP||11.8 mil (0.3mm) Lead Pitch||11.8 mil (0.3mm) Lead Pitch|
|BGA||BGA/FBGA/HFBGA||15.7 mil (0.4mm) Ball Pitch||15.7 mil (0.4mm) Ball Pitch|
We support SMD, both leaded and leadless, BGA, PTH, hybrid, SoP, and daughter-board style components. We do not currently support chip-on-board, or PCB integrated components. Inquire about support for stacked packages and flip-chip which can be done on a case-by-case basis.
We support dual-sided assembly at no extra charge.
Assembly Location, Machines
Prototype services, high mix low volume runs, and first articles of products are built and assembled in-house at our facility in Houston, Texas.
Our assembly line includes Mycronic MY200 pick and place machines, Mycronic MY500 paste jetters, Heller 9-zone reflow ovens, and RPS Rhythm Selective Solder machines. We also have process ovens for MSL requirements, automated wire cutting machines, and a wide array of hand-soldering/rework systems on our line.
High volume runs are provided by our manufacturing partner running MacroFab processes and software in Mexico.
The high volume run assembly line includes Panasonic CM602-L pick and place machines, Panasonic SP60-L paste printers, Jintuo JTE-800 reflow ovens, and GSD Wave Solder machines. They are also ISO 9001 certified.
IPC Quality Criteria for Assemblies
Unless otherwise requested, all assemblies are built to meet IPC-610-D Class 2 acceptance criteria.
RoHS/Lead-Free Solder Only
All assembly processes at MacroFab are designed to be RoHS compatible. We use SAC305 solder paste for surface mount components and SN100 solder for touch-up and through-hole soldering.
We are unable to use leaded, non-RoHS, or HMP solder in our processes.
No-Clean and Water-Soluble Flux
We currently use water-soluble fluxes and no-clean fluxes in our assemblies. All boards are water-washed during the assembly process, but small amounts of no-clean flux will remain after washing.
If your board components are water-sensitive, please see the article on The Parts Placement Screen about adding a note to the part for our Assemblers.
We follow all ESD safety procedures as documented in IPC-A-610. All of our work benches are grounded, and our floor is coated with a conductive sealant. Operators wear wrist straps at work stations, and heel straps for moving around the facility and moving product. All circuit boards are packaged in ESD bags prior to shipping.
We warranty our assemblies for 90 days for component failure/electrical defects, and for one year for workmanship issues.
If you need to return your assemblies or PCBs for rework, please see this article about Managing and Creating Returns.
Our goal is always to ensure that you have great, working products that exceed your specifications at a great price. We stand behind our work and will resolve any issues that arise. Please don’t hesitate to contact us if you run into any problems.