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Assembly Capabilities and Processes
Assembly Location and Machines
Prototype services, high mix low volume runs, and first articles of products are built and assembled in-house at our facility in Houston, Texas.
Our assembly line includes Mycronic MY200 pick and place machines, Mycronic MY500 paste jetters, Heller 9-zone reflow ovens, and RPS Rhythm Selective Solder machines. We also have process ovens for MSL requirements, automated wire cutting machines, and a wide array of hand-soldering/rework systems on our line.
High volume orders are provided by our manufacturing partners running MacroFab processes and software. All manufacturing partners are ISO 9001 certified.
Standard Manufacturing Process
The typical assembly process for an order at MacroFab is the following.
- Order gets combined with lots of similar orders; this spreads out the NRE charge for the run across all customers which significantly reduces the cost of prototypes
- MacroFab orders Parts and PCBs
- Once all the materials have arrived, the panel your order is on gets paste applied in our MY500
- SMT Parts are placed on the PCB inside the MY200 Pick and Place
- The panel then goes through the reflow oven
- Once the panel has cooled, through hole parts are installed and soldered
- Panel is then “de-panelized” to the individual orders for washing
- Final QC and packaging
We support SMD, both leaded and leadless, BGA, LGA, PTH, hybrid, SoP, and daughter-board style components. We do not currently support chip-on-board or PCB integrated components. Inquire about support for stacked packages and flip-chip, which can be done on a case-by-case basis.
Mechanical Limits on Part Package Size for Assembly
The parts to be assembled onto a PCB must be equal to or larger then the following specifications.
|Chip Components||Resistors/Capacitors||0201 20 mil x 10 mil (0.5mm x 0.25mm)|
|Leaded Packages||SOIC/QFN/TSOP||11.8 mil (0.3mm) Lead Pitch|
|BGA||BGA/FBGA/HFBGA||15.7 mil (0.4mm) Ball Pitch|
Double Sided Assembly
We support dual-sided assembly at no extra charge.
IPC Quality Criteria for Assemblies
Unless otherwise requested, all assemblies are built to meet IPC-610-D Class 2 acceptance criteria.
We follow all ESD safety procedures as documented in IPC-A-610. All of our work benches are grounded, and our floor is coated with a conductive sealant. Operators wear wrist straps at work stations, and heel straps for moving around the facility and moving product. All circuit boards are packaged in ESD bags prior to shipping.
RoHS/Lead-Free Solder Only
All assembly processes at MacroFab are designed to be RoHS compatible. We use SAC305 solder paste for surface mount components and SN100 solder for touch-up and through-hole soldering.
We are unable to use leaded, non-RoHS, or HMP solder in our processes.
No-Clean and Water-Soluble Flux
We currently use water-soluble fluxes and no-clean fluxes in our assemblies. All boards are water-washed during the assembly process, but small amounts of no-clean flux will remain after washing.
If your board components are water-sensitive, please see the article on The Parts Placement Screen about adding a note to the part for our Assemblers.
We warranty our assemblies for 90 days for component failure/electrical defects, and for one year for workmanship issues.
If you need to return your assemblies or PCBs for rework, please see this article about Managing and Creating Returns.
Our goal is always to ensure that you have great, working products that exceed your specifications at a great price. We stand behind our work and will resolve any issues that arise. Please don’t hesitate to contact us if you run into any problems.