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IoT (Internet of Things) markets need new manufacturing architectures to meet increasing technical demands. An IoT device's PCB allows transducers, processors, antennas, and other components to exchange data and power via electricity.
The challenge, however, lies in meeting tighter size constraints, stricter standards, and high-performance needs for PCBs for IoT products. Innovation in IoT hardware is threatened by these obstacles. In our whitepaper, we examine the benefits of cloud manufacturing to IoT design advancement and discuss:
A primer on how cloud manufacturing can drive IoT PCBA hardware innovation
Learn how to leverage cloud manufacturing services to stay competitive and focused on innovation