What We Do

World-Class PCBA Production Capabilities

Built In North America

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MacroFab Capabilities

CAPABILITIES

Overview

erai member
iatf certified company
iso 9001 certified
iso 13485 certified
rohs member
ul listed
as9001d certified

MacroFab capabilities include fine-pitch BGA, HDI, and QFN assembly. See below for an overview of our fabrication and assembly specifications. MacroFab’s manufacturing cloud offers up to IPC class 3 production and ISO9001:2015, ISO/IATF 16949, AS9100, and ISO13485 certifications. Our platform automatically converts your information from Eagle, Altium, PADS, KiCAD, DipTrace, OrCAD and Allegro, and offers complete workspace integration with Altimade.

Sourcing

  • Real-time stock visibility with integrated components suppliers
  • Turnkey service, inventory, and consignment supported
  • Alternative sourcing and lifecycle management

Fabrication

  • 2-36 layers
  • Blind, buried, micro-drilled vias
  • HDI, castellations, controlled impedance
  • Flip-chip capable
  • Encapsulating (Epoxy potting)
  • 14.9in x 14.9 in max board area

Assembly

  • Through-hole, SMD, hybrid, modules, box builds
  • Full product assembly
  • We support double-sided assembly
  • Cable and wire harness
  • 01005 10 mil x 05 mil
  • We follow all IPC-A-610 ESD safety procedures

Testing

  • Quality testing to meet your requirements
  • Functional testing
  • Burn-in
  • Flying probe
  • RF spectrum testing

BOARD LEVEL

Capabilities

Surface Finish

  • ENIG (standard)
  • ENIPIG
  • Lead-free HASL
  • EHG

Copper to Board Edge Clearance

  • 10mil min (0.15mm) - Standard mfg
  • 3mil min (0.07mm) - Extended mfg

Layer Count

  • 2
  • 4
  • 6
  • 8
  • 10
  • 12
  • 14
  • 16
  • 18
  • 20
  • 22
  • 24
  • 32

Fabrication Processes

  • Hard gold–supported
  • Edge fingers–supported
  • Beveled edges
  • Flying probe
  • Castellations

Dielectric Material Families

  • FR4-TG1785 (standard)
  • Rogers 4003C
  • Rogers 4350B
  • Rogers 4450B
  • Rigid-Flex
  • Aluminum
  • Other: requires custom quote

Controlled Impedance Layers

  • Supported

Board Area

  • Max dimensions: 14.9” x 14.9” (378.46mm x 378.46mm)
  • Minimum billable area: 1 square inch (25.4mm²)
  • Custom quote required for larger boards

Board Thickness

  • 0.062” (1.6mm) standard
  • 0.008”-0.248” (0.2mm-6.3mm) custom
  • PCB thickness increments at 0.0004” (0.1016mm)
  • Board thickness tolerance:
    • T < 1.0mm: ±15%
    • 1.0 > T<1.6mm: ±10%
    • T>1.6mm: ±10%

Quality Assurance

  • Unless otherwise requested, all assemblies are built to meet IPC-A-610H Class 2 Acceptance criteria
  • Visual inspection on all boards
  • X-Ray used for manufacturing validation
  • AOI only over a certain quantity (25 or more)

HOLES & VIAS

Capabilities

Drill and Mil

  • Internal rout radius- 0.8mm
  • External rout radius- 1.0mm
  • Laser drill- 4mil-8mil

Mechanical Drill Diameter

  • 10mil min (Standard Drill)
  • 4mil min (Extended Drill)

Laser Drill Diameter

  • 10mil min (Standard Drill)
  • 4mil min (Extended Drill)

Via Options Supported

  • Blind and buried vias
  • Back drilled vias
  • Micro drill vias
  • Epoxy filled and capped vias

Via Fill

  • Non-conductive Epoxy
  • Conductive epoxy
  • Copper

Mechanical Through Via Aspect Ratio

  • 10 max (standard drill)
  • 16 max (extended drill)

Laser Blind Via Aspect Ratio

  • Supported as per our minimal drill size in DRC

COPPER

Capabilities

Drill and Mil

  • Internal rout radius- 0.8mm
  • External rout radius- 1.0mm
  • Laser drill- 4mil-8mil

Mechanical Drill Diameter

  • 10mil min (Standard Drill)
  • 4mil min (Extended Drill)

Laser Drill Diameter

  • 10mil min (Standard Drill)
  • 4mil min (Extended Drill)

Via Options Supported

  • Blind and buried vias
  • Back drilled vias
  • Micro drill vias
  • Epoxy filled and capped vias

Via Fill

  • Non-conductive Epoxy
  • Conductive epoxy
  • Copper

Mechanical Through Via Aspect Ratio

  • 10 max (standard drill)
  • 16 max (extended drill)

Laser Blind Via Aspect Ratio

  • Supported as per our minimal drill size in DRC

SOLDERMASK & SILKSCREEN

Capabilities

Solder

  • RoHS/lead-free solder only
  • SAC305 for surface mount
  • SN100 only for through-hole
  • Solder resist: top and bottom standard

Soldermask Colors

  • Red
  • Green
  • Blue
  • Yellow
  • Black
  • White
  • Matte Black
  • Dark Brown
  • Transparent
  • Light Green
  • Matte Green

Soldermask Dam

  • .1mm

Soldermask Pad Relief

  • Min 4mil

Silkscreen Colors

  • Red
  • Green
  • Blue
  • Yellow
  • Black
  • White

Minimum Silkscreen Size

  • 5mil

OTHER

Capabilities

Flux

  • SMT: no-clean
  • Through-hole: no-clean or water wash

Castellations

  • Supported

Partner Facility Certifications

  • AS9100D
  • UL Registered
  • ISO13485
  • ISO/IATF 16949
  • ISO9001
  • ISO14001

Assembly Supported

  • Single-sided or double-sided
  • Through-hole
  • SMD
  • BGA
  • LGA
  • PTH
  • Hybrid
  • SoP
  • Daughterboard components
  • Modules
  • We support double-sided assembly

Depanalization

  • Linear blade
  • Mouse bites
  • Routed

Component Programming

  • Supported

Mechanical Limits

  • Chip components, ex: resistors/ capacitors 01005 10 mil x 05 mil (0.25mm x 0.0125mm)
  • Leaded packages, ex: SOIC/QFP/TSOP 11.8 mil (0.3mm) Lead Pitch
  • Leadless packages, ex: QFN, TQFN 11.8 mil (0.3mm) Lead Pitch
  • BGA, ex: BGA/FBGA/LGA 15.7 mil (0.4mm) Ball Pitch

Conformal Coating

A UV tracer is added to all conformal coating and boards are inspected under a UV light according to certified industry standards.

  • Acrylic
  • Silicone
  • Polyurethane

Additional Resources