Welcome back everyone! This week on the MacroFab Roundup: Intel may or may not kill of its 10nm process, Breadboarding at the gold bonding level inside ICs, IoT Security Oversight, and Practical implementations of Supply Chain attack vectors and Hardware Implants.
Interesting Links and Articles
- Intel kills off the 10nm process?
- Intel says they are not cancelling its 10nm process
- Will Moore’s Law finally fail or will AMD take the process lead by using TSMC 10nm process?
- The Future of SiP: Providing a BreadBoard in a Tiny Package
- SiP or System-in-Package style parts can enable greater levels of component integration
- To provide easier customization of these SiP components a “grid like” section that has default power and I/O connections can be implemented much like a breadboard
- SMCube – modeling, simulation, code generation of discrete time finite state machines
- Tool for modeling state machines
- Generates a C++ and C language implementation of the state machine
- Does the IoT Need Oversight? UK Introduces “Code of Practice” of Cybersecurity for IoT Developers
- Do IoT device development need oversight similar to bank and accounting software?
- Stephen and Parker have talked about IoT security practices a couple times on the MacroFab Engineering Podcast
- Infecting The Embedded Supply Chain – Zach and Alex – DEF CON 26 presentation
- How to infect the embedded supply chain through development tools and various other attack vectors
- This is an interesting precursor to the Bloomberg Article which came out after Zach and Alex’s presentation at DEF CON 26
- Chris Church and Misha Govshteyn talk about supply chain security on MEP EP #142: Supply Chain Conspiracy Securities
- Building a Proof of Concept Hardware Implant
- Using a microcontroller to take control of the Baseboard Management Controller (BCM) and modify the EEPROM on a network card
- This allowed direct control of the network card and was able to send and intercept Ethernet Packets
- Ideal op-amp datasheet
MacroFab Engineering Podcast
This week on MEP EP #143: System-In-Package Platforms – Gene Frantz and Erik Welsh of Octavo Systems join the MEP to discuss how SiP components can benefit hardware designers.
MacroFab IRL Events
- Hardware & Electronics Engineering Meetup by MacroFab & Mouser Electronics
- Octavo Systems
- November 28th at 6PM