Welcome back everyone! This week on the MacroFab Roundup: A post-mortem on the MRI/iOS device situation, ground bounce on PCB designs, more Tariffs, and LULZCODE.
Interesting Links and Articles
- Post-mortem: MRI disables every iOS device in facility
- Helium did kill all those iOS devices due to the helium invading the MEMs devices inside
- How to Reduce Ground Bounce: Mitigating Noise with PCB Design Best Practices
- What is ground bounce and why is it bad for circuit design?
- Covers mitigation techniques with component usage, layout considerations, and programming techniques
- System76 on US Manufacturing and Open Hardware
- System76 is designing and manufacturing the “Thelio” line of open source computer system
- Chinese chipmakers brace for next US crackdown
- Potential next wave of tariffs will hit integrated circuits
- China is currently spinning up massive semiconductor facilities that might not be able to be profitable if these tariffs land
- Proper Sorting: New Adhesive for Better Recycling
- Karlsruhe Institute of Technology has developed a thermolabile adhesive
- This adhesive is stable at room temperature, but can be decomposed precisely and rapidly at low temperatures in a fashion called Debonding on Demand
- The chemical compounds open at moderate temperatures below 100°C and the adhesive disintegrates allowing the devices to be disassembled and recycled easier
MacroFab Engineering Podcast
This week on MEP EP #144: Espress-ify? Designing Products Around the ESP-32 Platform – Zapp and Hyr0n of AND!XOR join Cr4bf04m and Bl1tz to talk about Badge Engineering and the Espressif ESP-32.
MacroFab IRL Events
- Hardware & Electronics Engineering Meetup by MacroFab & Mouser Electronics
- Octavo Systems
- November 28th at 6PM